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INTEGRATED CIRCUITS
DATA SHEET
UAA3220TS Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
Product specification Supersedes data of 1998 April 10 File under Integrated Circuits, IC01 1999 Jan 22
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
FEATURES * Low cost single-chip ASK or FSK receiver * Superheterodyne architecture with high integration level * Few external low cost components and crystal required * Wide supply voltage range * Low power consumption * Wide frequency range, 250 to 920 MHz * High sensitivity * IF bandwidth determined by application * High selectivity * Automotive temperature range * SSOP24 package. Applications * Keyless entry systems * Car alarm systems * Remote control systems * Security systems * Telemetry systems * Wireless data transmission * Domestic appliance. QUICK REFERENCE DATA SYMBOL VCC ICC PARAMETER supply voltage supply current fi(RF) = 433.92 MHz; FSK mode operating mode on; VPWD = 0 V operating mode off; VPWD = VCC ASK mode Pi(max)(ASK) i(ASK) FSK mode Pi(max)(FSK) i(FSK) maximum input power sensitivity into pin MIXIN BER 3% fi(RF) = 433.92 MHz; BER 3% -6 - 0 -103 maximum input power sensitivity into pin MIXIN BER 3% fi(RF) = 433.92 MHz; BER 3% -22 - -16 -119 2.8 - 4.3 3 CONDITIONS MIN. 2.7 - TYP. GENERAL DESCRIPTION
UAA3220TS
The UAA3220TS is a fully integrated single-chip receiver, primarily intended for use in VHF and UHF systems. It supports both Amplitude Shift Keying (ASK) and Frequency Shift Keying (FSK) demodulation. By connecting DEMO1 (pin 10) to ground during realisation of the receiver module the UAA3220TS works as an ASK receiver (see Fig.10). By connecting pin 10 as shown in Fig.9 the UAA3220TS works as an FSK receiver. The UAA3220TS incorporates a crystal stabilized local oscillator, frequency multiplier, balanced mixer, post mixer amplifier, limiter, Received Signal Strength Indicator (RSSI), FSK demodulator, data filter, data slicer and power down circuit.
MAX. 5.5 5.8 30 V
UNIT
mA A
-10 -113
dBm dBm
+1 -100
dBm dBm
1999 Jan 22
2
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
ORDERING INFORMATION TYPE NUMBER UAA3220TS BLOCK DIAGRAM PACKAGE NAME SSOP24 DESCRIPTION
UAA3220TS
VERSION SOT340-1
plastic shrink small outline package; 24 leads; body width 5.3 mm
MGND MIXIN handbook, full pagewidth 24 23
FA VCCI LIN 22 21 20 LIMITER AMPLIFIER
LFB 19
RSSI CPC 18 17
CPB 16
CPA 15
DATA 14
CGND 13
MIXER PMA
DEMODULATOR
AM/FM SWITCH
UAA3220TS + -
OSCILLATOR MULTIPLIER x3 BIAS DATA SLICER
x2/x3
1
2
3 OSB
4 VCC
5 OSC
6
7
8 TP
9 PWD
10 DEMO1
11 DEMO2
12
MGM742
OGND OSE
TEM TN
GND
Fig.1 Block diagram.
1999 Jan 22
3
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
PINNING SYMBOL OGND OSE OSB VCC OSC TEM TN TP PWD DEMO1 DEMO2 GND CGND DATA CPA CPB CPC RSSI LFB LIN VCCI FA MIXIN MGND PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 DESCRIPTION oscillator ground oscillator emitter oscillator base positive supply voltage oscillator collector frequency multiplier emitter resistor frequency multiplier negative output frequency multiplier positive output power down control input FM demodulator 1, ASK/FSK switch FM demodulator 2 general ground comparator ground data output comparator input A comparator input B comparator input C RSSI output limiter feedback limiter input IF amplifier positive supply voltage IF amplifier output mixer input mixer ground
TP 8 PWD 9 DEMO1 10 DEMO2 11 GND 12
MGM743
UAA3220TS
handbook, halfpage
OGND 1 OSE 2 OSB 3 VCC 4 OSC 5 TEM 6
24 MGND 23 MIXIN 22 FA 21 VCCI 20 LIN 19 LFB
UAA3220TS
TN 7 18 RSSI 17 CPC 16 CPB 15 CPA 14 DATA 13 CGND
Fig.2 Pin configuration.
1999 Jan 22
4
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
FUNCTIONAL DESCRIPTION Mixer The mixer is a single-balanced emitter-coupled mixer with internal biasing. Matching of the RF source impedance to the mixer input requires an external matching network. Oscillator The oscillator is based on a transistor connected in common collector configuration followed by a cascode stage driving a tuned circuit. The voltage at this tuned circuit drives the frequency multiplier. The bias current of the oscillator is set by an off-chip resistor (R40 in the application diagram of Fig.9) to a typical value of 260 A at 433.92 MHz (R40 = 1.8 k). The oscillator frequency is controlled by an off-chip overtone crystal (X40). Off-chip capacitors between base and emitter (C42) and ground (C41) make the oscillator transistor appear as having negative resistance at small signal levels. This causes the oscillator to start. A parallel resonance circuit (L40 and C41) connected to the emitter of the oscillator transistor prevents oscillation at the fundamental frequency of the crystal. The LC tank circuit at the output of the oscillator is used to select either the fundamental, the second or the third harmonic of the oscillator frequency. Frequency multiplier The frequency multiplier is an emitter-coupled transistor pair driving an off-chip balanced tuned circuit. The bias current of this emitter coupled pair is set by an off-chip resistor (R50) to a typical value of 350 A at 433.92 MHz (R50 = 1.2 k). The oscillator output signal is AC-coupled to one of the inputs of the emitter-coupled pair. The other input is connected to ground via an on-chip capacitor. The output voltage of the frequency multiplier drives the switching stage of the mixer. The bias voltage at this point is set by an off-chip resistor (R51) to allow sufficient voltage swing at the mixer outputs. Post mixer amplifier The Post Mixer Amplifier (PMA) is a differential input, single-ended output amplifier. Amplifier gain is provided in order to reduce the influence of the limiter noise figure on the total noise figure. Limiter
UAA3220TS
The limiter is a single-ended input multiple stage amplifier with high total gain. Amplifier stability is achieved by means of an external DC feedback capacitor (C21), which is also used to determine the lower limiter cut-off frequency. An RSSI signal proportional to the limiter input signal is provided. Figure 3 shows the DC voltage at pin 18 (RSSI) as a function of the input voltage (RMS value) at pin 20 (LIN). It also gives the typical IF of 10.7 MHz. The lower knee of the level curve (see Fig.3) is determined by the effective noise bandwidth and is, consequently, slightly higher. IF filter IF filtering with high selectivity is realized by means of an external ceramic filter (X20), which feeds the IF from the PMA to the limiter. FM demodulator Coming from the limiter the FSK signal is fed differential to the input of the FM demodulator. After buffering the signal is fed to a phase detector. The phase shift is generated by an external LC combination connected to DEMO1 (pin 10) and DEMO2 (pin 11). The baseband signal is coupled out single ended via an output buffer and is fed to the FSK input of the ASK/FSK switch. ASK/FSK switch The selection of either ASK or FSK reception will be done by the DEMO1 (pin 10). Grounding this pin to 0 V will switch the IC to ASK mode. Additional the FM demodulator and parts of the data slicer will be switched off. In FSK mode DEMO1 (pin 10) is connected to DEMO2 (pin 11) via a LC combination (see Fig.9). Data filters After demodulation a two-stage data filtering circuit is provided in order to suppress unwanted frequency components. Two RC low-pass filters with on-chip resistors are provided which are separated by a buffer stage.
1999 Jan 22
5
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
Data slicer Data detection is provided by means of a level comparator with adaptive slice reference. After the first data filter stage the pre-filtered data is split into two paths. One passes the second data filter stage and is fed to the positive comparator input. The other path is fed to an integration circuit with a large time constant in order to derive the average value (DC component) as an adaptive slice reference which is presented to the negative comparator input. The internal buffer provides 13 dB AC voltage gain. The adaptive reference allows to detect the received data over a large range of noise floor levels. The integration circuit consists of a simple RC low-pass filter with on-chip resistors. The data slicer output is designed with internal pull-up. RSSI buffer
UAA3220TS
The RSSI buffer is an amplifier with a voltage gain of 0 dB. At FSK receive mode the RSSI output provides a field strength indication. It has an output impedance of 10 k. Figure 3 shows the level curve (RSSI curve) as a function of the limiter input voltage (RMS value).
handbook, full pagewidth
1.55
MGM744
VRSSI (V) 1.45
(1)
(2)
1.35
(3)
1.25
1.15 10-7
10-6
10-5
10-4
10-3
10-2
-1 VLIN(rms) (V) 10
(1) Tamb = 85 C. (2) Tamb = 27 C. (3) Tamb = -40 C.
Fig.3 Level curve VRSSI as a function of VLIN(rms).
1999 Jan 22
6
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCC Pi(max) Tamb Tstg Ves supply voltage absolute maximum input power operating ambient temperature storage temperature electrostatic handling pins 3 and 6 pin 2 pin 5 pin 23 all other pins Note 1. Machine model: C = 200 pF, R = 0 and L = 0.75 H; pins are connected to GND and VCC. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 125 note 1 -50 -100 -250 -200 -250 PARAMETER CONDITIONS - -40 -55 MIN. -0.3 3
UAA3220TS
MAX. +8.0 +85 +125 +50 +100 +150 +250 +250 V
UNIT dBm C C V V V V V
UNIT K/W
1999 Jan 22
7
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
UAA3220TS
DC CHARACTERISTICS VCC = 2.7 V; Tamb = 25 C; for application diagram see Figs 9 and 10; crystal disconnected; unless otherwise specified. SYMBOL Supplies VCC ICC supply voltage supply current operating mode on; VPWD = 0 V; notes 1 and 2 FSK demodulation; note 3 ASK demodulation; note 4 operating mode off; VPWD = VCC VPWD voltage on pin PWD operating mode on (receiving mode) operating mode off (sleep mode) IPWD current into pin PWD operating mode on (receiving mode); VPWD = 0 V operating mode off (sleep mode); VPWD = VCC Oscillator VOSE VOSB Multiplier VTEM VTN,TP Mixer VMIXIN VFA Limiter VLIN VLFB VRSSI DC voltage at pin 20 DC voltage at pin 19 DC voltage at pin 18 independent of oscillator independent of oscillator independent of oscillator 1.85 1.85 1.00 1.95 1.95 1.16 2.05 2.05 1.32 V V V DC voltage at pin 23 independent of oscillator 0.68 0.78 0.88 V DC voltage at pin 6 DC voltage at pins 7 and 8 independent of oscillator independent of oscillator 0.33 2.01 0.39 2.21 0.45 2.41 V V DC voltage at pin 2 DC voltage at pin 3 independent of oscillator independent of oscillator 0.33 1.05 0.38 1.15 0.43 1.25 V V 2.8 2.5 - 0 4.3 3.7 3 - 5.8 4.9 30 300 VCC -3 mA mA A mV V A 2.7 - 5.5 V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VCC - 0.3 - -30 -10
-
2
15
A
Post mixer amplifier DC voltage at pin 22 independent of oscillator 1.10 1.25 1.40 V
1999 Jan 22
8
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
SYMBOL Demodulator VDEMO1,2 VDEMO1(ASK) DC voltage at pins 10 and 11 DC voltage at pin 10 to switch in ASK mode independent of oscillator; note 5 2.00 0 2.24 - PARAMETER CONDITIONS MIN.
UAA3220TS
TYP.
MAX.
UNIT
2.48 300
V mV
Data filter and slicer VCPA,CPB,CPC VOH(DATA) VOL(DATA) Notes 1. For fi(RF) = 868.35 MHz all values + 0.6 mA. 2. Crystal connected; oscillator and multiplier active. 3. Pin DEMO1 connected to pin DEMO2 via tank circuit. 4. Pin DEMO1 short circuited to ground. 5. The given values are applicable for FSK reception mode. In ASK mode pin 10 is short circuited to ground. 6. No modulation and fIF = 10.7 MHz. DC voltage at pins 15, 16 and 17 ASK mode FSK mode; note 6 HIGH-level output voltage at pin 14 IDATA = -10 A LOW-level output voltage at pin 14 IDATA = 200 A 1.27 1.81 0 1.42 2.01 - 1.57 2.21 VCC 0.6 V V V V
VCC - 0.5 -
1999 Jan 22
9
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
UAA3220TS
AC CHARACTERISTICS VCC = 2.7 V; Tamb = 25 C; for application diagram see Figs 9 and 10; fi(RF) = 433.92 MHz (see Table 4) and fi(RF) = 868.35 MHz (see Table 5); fmod = 1 kHz square wave; unless otherwise specified. SYMBOL System performance fi(RF) fIF Pi(max) RF input frequency IF frequency maximum input power ASK mode; BER 3%; notes 1 and 2 FSK mode; BER 3%; notes 2 and 3 PSPUR fDATA ton(RX) spurious radiation data frequency receiver turn-on time note 4 note 5 notes 6 and 7 fi(RF) = 433.92 MHz fi(RF) = 868.35 MHz VRSSI ASK mode i(ASK) input sensitivity directly into pin MIXIN BER 3%; notes 1 and 2 fi(RF) = 433.92 MHz fi(RF) = 868.35 MHz FSK mode i(FSK) f Gdem input sensitivity directly into pin MIXIN frequency deviation (peak value) f = 4 kHz note 8 demodulator gain BER 3%; notes 2 and 3 - 4 - 0.75 -103 10 - 1.0 -100 75 3 1.25 dBm kHz dB mV --------kHz dBm dB - - -119 -116 -113 -110 dBm dBm RSSI voltage - - 1.1 6 3 - 10 7 1.6 ms ms V 250 10.56 - -22 -6 - - - 10.7 - -16 0 - 1 920 10.84 3 -10 +1 -57 - MHz MHz dBm dBm dBm dBm kHz PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
(FSK)(max) maximum sensitivity degradation
Mixer and post mixer amplifier Zi IP3PMA GPMA Zo(IF) input impedance of mixer interception point (mixer + PMA) gain (mixer + PMA) output impedance of IF amplifier note 9 fi(RF) = 433.92 MHz fi(RF) = 868.35 MHz - - -38 40 280 600 300 -30 42 330 - - - 50 380
1999 Jan 22
10
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
SYMBOL Limiter Ri(LIN) Buffer RCPC Gbuffer RCPA,CPB data buffer output resistance at pin 17 data buffer AC gain data buffer output resistance at pins 15 and 16 24 12 120 30 13 150 limiter input resistance 40 48 PARAMETER CONDITIONS MIN.
UAA3220TS
TYP.
MAX.
UNIT
56
k
36 14 180
k dB k
Data slicer; see Chapter "DC characteristics" Bds Notes 1. 100% AM modulation (ASK); available power from generator into a 50 load. 2. With external matching network, to transform the impedance to 50 . 3. f = 10 kHz; available power from generator into a 50 load. 4. Measured at the RF input connector of the test board into a 50 load; fi(RF) = 25 MHz to 1 GHz. 5. The data frequency range can be varied by changing C30 to C32 (see Figs 9 and 10) to match other bit rates. Data frequency determined by data slicer application. 6. ton = 50 ms; toff = 138 ms; P = Psens + 3 dB. 7. The given turn-on time is only valid during strobing by pin PWD; if the IC is strobed on and off by the supply voltage the turn-on time will be longer. 8. LC tank circuit (L60, C60) tuned to maximum phase slope. 9. GPMA is typically 6 dB lower when measured in the application, because of the load of the ceramic filter. internal data slicer bandwidth 50 - 100 kHz
1999 Jan 22
11
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
INTERNAL CIRCUITRY Table 1 PIN NO. 1 2 3 5
UAA3220TS
Equivalent pin circuits and pin voltages for rough test of printed-circuit board; VCC = 2.7 V; no input signal PIN SYMBOL OGND OSE OSB OSC 0 0.38 1.15 2.7
3 2 8.15 k GND 1
MHA780
DC VOLTAGE (V)
EQUIVALENT CIRCUIT
5 VCC
4 6 7 8
VCC TEM TN TP
2.7 0.39 2.21 2.21
9.6 k 5 7 8 GND VCC
6
MHA781
9
PWD
-
VCC
210 k 9
MGM750
10 11 12
DEMO1 DEMO2 GND
2.24 2.24 0
7 k 11 7 k 10 10 k
12
MGM751
1999 Jan 22
12
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
PIN NO. 13 15 16 PIN SYMBOL CGND CPA CPB 0 1.95 1.95
15 150 k 150 k 16
UAA3220TS
DC VOLTAGE (V)
EQUIVALENT CIRCUIT
VCC
13
MGM753
14
DATA
-
VCC
1 k 14
13
MGM754
17
CPC
1.95
VCC
30 k
17 GND
MGM755
18
RSSI
1.16
10 k 18
12
MGM752
1999 Jan 22
13
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
PIN NO. 19 LFB PIN SYMBOL DC VOLTAGE (V) 1.95 EQUIVALENT CIRCUIT
UAA3220TS
VCC
19
GND
MGM756
20
LIN
1.95
VCC
48 k 20
GND
MGM757
21 22
VCCI FA
2.7 1.25
21
330
22
GND
MGM758
23 24
MIXIN MGND
0.78 0
23
15 24
MGM759
1999 Jan 22
14
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
TEST INFORMATION Tuning procedures TUNING PROCEDURE FOR AC TESTS
UAA3220TS
1. Turn on the signal generator (fi(RF) = 433.92 or 868.35 MHz; no modulation; RF input level = -50 dBm). 2. Tune first C50 (multiplier tank circuit), second C11 (RF stage input) to obtain a peak IF voltage at pin FA. TUNING PROCEDURE FOR ASK RECEPTION 1. Make sure that pin DEMO1 is short circuited to ground. 2. Turn on ASK modulation and check that data is appearing on the DATA output pin and proceed with the AC tests. TUNING PROCEDURE FOR FSK RECEPTION 1. Make sure that pins DEMO1 and DEMO2 are connected by the LC tank circuit. 2. Turn on FSK modulation (f = 10 kHz; RF input level = -103 dBm). 3. Tune C61 (or L60) (phase shifter LC tank circuit) to obtain a peak LF voltage at pin CPC. 4. Check that data is appearing on pin DATA and proceed with the AC tests. AC test conditions Table 2 Test signals The reference signal level Pref for the following tests is defined as the minimum input level in dBm to give a BER 3 x 10-2 (e.g. 60 bit errors per second for 2000 bits/s). All test signal levels refer to 50 load condition. TEST SIGNAL 1 2 3 4 FREQUENCY (MHz) 433.92/868.35 433.92/868.35 433.92/868.35 433.82/868.35 DATA SIGNAL 1000 Hz square wave 1000 Hz square wave - - MODULATION AM (ASK) FM (FSK) no modulation no modulation MODULATION INDEX 100% - - - FREQUENCY DEVIATION - 10 kHz - -
1999 Jan 22
15
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
UAA3220TS
Table 3 Tests and results P1 is the maximum available power from signal generator 1 at the input of the test board; P2 is the maximum available power from signal generator 2 at the input of the test board. GENERATOR TEST 1 ASK sensitivity into pin MIXIN (see Fig.5) modulated test signal 1; P1 -113 dBm for fi(RF) = 433.92 MHz; P1 -110 dBm for fi(RF) = 868.35 MHz modulated test signal 2; P1 -100 dBm - 2 BER 3 x 10-2 (e.g. 60 bit errors per second for 2000 bits/s) RESULT
FSK sensitivity into pin MIXIN (see Fig.5)
- - - -
BER 3 x 10-2 (e.g. 60 bit errors per second for 2000 bits/s) BER 3 x 10-2 (e.g. 60 bit errors per second for 2000 bits/s) BER 3 x 10-2 (e.g. 60 bit errors per second for 2000 bits/s) check that the first 10 bits are correct; error counting is started 10 ms after power down is switched into operating mode on measure with high impedance probe at pin FA IM3 IP3 PMA = P 1 + --------- dBm (for IM3 see Fig.6) 2 no spurious signals (25 MHz to 1 GHz) with level higher than maximum PSPUR
Maximum input power modulated test signal 1; for ASK (see Fig.5) P1 -22 dBm Maximum input power modulated test signal 2; for FSK (see Fig.5) P1 -6 dBm Receiver turn-on time; see note 1 and Fig.4 Interception point (mixer + PMA) see note 2 and Fig.6 Spurious radiation; see note 3 and Fig.7 Notes modulated test signal 1 or 2; P1 = Pref + 3 dB test signal 3; P1 = -40 dBm -
test signal 4; P2 = P1 -
1. The voltage at pin PWD of the test circuit alternates between operating mode: on (50 ms; 0 V) and off (138 ms; VCC); see Fig.4. 2. Probe of spectrum analyzer connected to pin FA (pin 22). 3. Spectrum analyzer connected to the input of the test board.
handbook, full pagewidth
VPWD (V) 2.7
0 0 50 188 238 376 426 t (ms)
MGM745
Fig.4 Timing diagram for pulsed power down voltage.
1999 Jan 22
16
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
UAA3220TS
GENERATOR 1 50 TEST CIRCUIT (1) BER TEST FACILITY (2)
MED900
(1) For test circuit see Fig.9. (2) For BER test facility see Fig.8.
Fig.5 Test configuration A (single generator).
GENERATOR 1 50
50 2-SIGNAL POWER COMBINER GENERATOR 2 50
TEST CIRCUIT (1)
SPECTRUM ANALYZER WITH PROBE
IM3
f
f f = 100 kHz
f
MED901
(1) For test circuit see Fig.9.
Fig.6 Test configuration C (IP3).
1999 Jan 22
17
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
UAA3220TS
SPECTRUM ANALYZER INPUT IMPEDANCE 50
TEST CIRCUIT (1)
MED902
(1) For test circuit see Fig.9.
Fig.7 Test configuration D (spurious radiation).
SIGNAL GENERATOR
TX data
MASTER CLOCK
BIT PATTERN GENERATOR
DEVICE UNDER TEST
delayed TX data
PRESET DELAY
RX data
INTEGRATE AND DUMP
DATA COMPARATOR BER TEST BOARD
MED904
to error counter
Fig.8 BER test facility.
1999 Jan 22
18
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1999 Jan 22 19
APPLICATION INFORMATION
Philips Semiconductors
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
50
RF input C10 X20 L10 C11
VCC
C22 R20
RSSI
data output
C12 MGND 24 MIXIN 23 FA 22 VCCI 21
C20 LIN 20 LIMITER AMPLIFIER
C21
C33 LFB 19 RSSI 18
C30 CPC 17
C32 CPB 16
C31 CPA 15 DATA 14 CGND 13
MIXER PMA
DEMODULATOR
AM/FM SWITCH
UAA3220TS + -
OSCILLATOR MULTIPLIER x3 BIAS DATA SLICER
x2/x3
1 OGND
2 OSE C42
3 OSB
4 VCC
5 OSC
6 TEM
7 TN C50
8 TP
9 PWD
10 DEMO1 C60 C61
11 DEMO2
12 GND
MGM747
L40
R41 C41 X40
C43
L41 R51
R50
L50
L51 R60 power-down C51 L60
R40
C40 VCC
C70
C44
UAA3220TS
Product specification
Fig.9 Application diagram (FSK reception).
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1999 Jan 22 20
Philips Semiconductors
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
50
RF input C10 X20 L10 C11
VCC
C22 R20
RSSI
data output
C12 MGND 24 MIXIN 23 FA 22 VCCI 21
C20 LIN 20 LIMITER AMPLIFIER
C21
C33 LFB 19 RSSI 18
C30 CPC 17
C32 CPB 16
C31 CPA 15 DATA 14 CGND 13
MIXER PMA
DEMODULATOR
AM/FM SWITCH
UAA3220TS + -
OSCILLATOR MULTIPLIER x3 BIAS DATA SLICER
x2/x3
1 OGND
2 OSE C42
3 OSB
4 VCC
5 OSC
6 TEM
7 TN C50
8 TP
9 PWD
10 DEMO1
11 DEMO2
12 GND
MGM748
L40
R41 C41 X40
C43
L41 R51
R50
L50
L51 power-down C51
R40
C40 VCC
C70
C44
UAA3220TS
Product specification
Fig.10 Application diagram (ASK reception).
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
Table 4 Component list for Figs 9 and 10; fi(RF) = 433.92 MHz COMPONENT CHARACTERISTICS COMPONENT VALUE R20 R40 R41 R50 R51 R60 C10(1) C11 C12 C20 C21 C22 C30 C31 C32 C33 C40 C41(1) C42 C43(1) C44 C50 C51 C60(2) C61(2) C70 L10(3) L40 L41 L50(3) L51(3) L60(2) X20 X40 330 1.8 k 1.2 k 1.5 k 4.7 k 2.7 pF 100 pF 1 nF 47 nF 1 nF 2.7 nF 470 pF 47 nF 10 nF 1 nF 15 pF 15 pF 8.2 pF 1 nF 1 nF 82 pF TOLERANCE 2% 2% 2% 2% 2% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% 10% TEMPERATURE LOSS FACTOR COEFFICIENT AT 1 MHz (ppm/K) +50 +50 - +50 +50 +50 0 30 0 300 0 30 0 30 0 30 0 30 0 30 0 30 0 30 0 30 0 30 0 30 0 30 0 30 0 30 0 300 0 30 0 30 0 300 - +25 to +125 +25 to +125 +25 to +125 +25 to +125 +25 to +125 +25 to +125 - - - - - - tan 20 x tan 10 x tan 10 x tan 10 x tan 10 x tan 10 x tan 20 x tan 20 x tan 20 x tan 10 x tan 10 x tan 10 x tan 10 x - - - - - - - 10-4 10-4 10-4 10-4 10-4 10-4 10-4 10-4 10-4 10-4 10-4 10-4 10-4 - - - - - - - - - - - - - - - - - - - - QUALITY FACTOR
UAA3220TS
SELF RESONANCE FREQUENCY - - - - - - - - - - - - - - - - - - - - - - - - - - 3 GHz 400 MHz 1 GHz 3 GHz 3 GHz 150 MHz
not placed -
tan 20 x 10-4 -
3 to 10 pF -
tan 10 x 10-4 -
tan 10 x 10-4 -
tan 10 x 10-4 -
tan 10 x 10-4 -
3 to 10 pF -
tan 20 x 10-4 -
5 to 30 pF - not placed - 8 nH 560 nH 100 nH 8 nH 8 nH 2.2 H 5% 10% 10% 5% 5% 10%
140 at 150 MHz 45 at 100 MHz 60 at 350 MHz 140 at 150 MHz 140 at 150 MHz 37 at 7.9 MHz
ceramic filter, Murata SFE 10.7 MA 5 A; see note 4 3rd overtone crystal, 70.5367 MHz; see note 5
1999 Jan 22
21
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
Notes 1. C10, C41 and C43 can be placed as tuning capacitors on the PCB. 2. C60, C61 and L60 can be substituted by an LC tank. 3. L10, L50 and L51 are 3 turn air coils.
UAA3220TS
4. 3 dB bandwidth: 280 50 kHz; insertion loss: 4 dB typical and 6 dB maximum; spurious: 30 dB minimum at 8 to 12 MHz; input and output impedance: 330 . 5. Motional resistance: Rm 20 ; static capacitance: C0 6 pF; load capacitance: CL = 6 pF; loaded parallel resonance frequency: 70.5367 MHz; drive level dependency: Rm 20 (1 nW P 1 mW).
1999 Jan 22
22
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
Table 5 Component list for Figs 9 and 10; fi(RF) = 868.35 MHz COMPONENT CHARACTERISTICS COMPONENT VALUE R20 R40 R41 R50 R51 R60 C10 C11 C12 C20 C21 C22 C30 C31 C32 C33 C40 C41 C42 C43 C44 C50 C51 C60(2) C61(2) C70 L10(3) L40 L41 L50(3) L51(3) L60(2) X20 X40 330 1.5 k not placed 390 330 4.7 k 27 pF 27 pF 1 nF 47 nF 1 nF 3.3 nF 680 pF 10 nF 10 nF 1 nF 12 pF 12 pF 4 pF 47 pF 47 pF 82 pF 5 to 30 pF 4.7 F - 560 nH 39 nH - - 2.2 H TOLERANCE 5% 5% - 5% 5% 5% 5% 5% 10% 10% 10% 10% 10% 10% 10% 10% 5% 5% 0.25 pF 5% 5% 5% - 20% - 10% 10% - - 10% TEMPERATURE COEFFICIENT (ppm/K) 100 100 - 100 100 100 0 30 0 300 0 30 15%(1) 15%(1) 15%(1) 15%(1) 15%(1) 15%(1) 15%(1) 15%(1) 0 30 0 30 0 30 0 30 0 300 0 30 0 30 0 300 15%(1) - +25 to +125 +25 to +125 - - +25 to +125 LOSS FACTOR AT 1 MHz - - - - - - tan 10 x 10-4 tan 20 x tan 10 x 10-4 10-4 - - - - - - - - - - - - - - - - - - - - - - - - - - -
UAA3220TS
QUALITY FACTOR
SELF RESONANCE FREQUENCY - - - - - - - - - - - - - - - - - - - - - - - - - - - 415 MHz 1.5 GHz - - 140 MHz
1.7 to 3 pF -
tan 2.5% tan 2.5% tan 2.5% tan 2.5% tan 2.5% tan 2.5% tan 2.5% tan 2.5% tan 10 x tan 15 x tan 10 x tan 10 x tan 10 x tan 0.06 - - - - - - 10-4 10-4 10-4 10-4 10-4 10-4 tan 10 x 10-4
2.5 to 6 pF -
tan 20 x 10-4
tan 3.4 x
30 at 25 MHz 50 at 50 MHz - - 20 at 7.9 MHz
ceramic filter, Murata SFE 107 MA 5 A; see note 4 3rd overtone crystal, 95.2944 MHz; see note 5
1999 Jan 22
23
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
Notes 1. Temperature coefficient given as maximum C/C over temperature range. 2. C60, C61 and L60 can be substituted by an LC tank. 3. Realized as microstrip line; see Fig.12.
UAA3220TS
4. 3 dB bandwidth: 280 50 kHz; insertion loss: 4 dB typical and 6 dB maximum; spurious: 30 dB minimum at 8 to 12 MHz; input and output impedance: 330 . 5. Motional resistance: Rm 20 ; static capacitance: C0 6 pF; load capacitance: CL = 6 pF; loaded parallel resonance frequency: 95.2944 MHz; drive level dependency: Rm 20 (1 nW P 1 mW).
1999 Jan 22
24
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
UAA3220TS
handbook, full pagewidth
47
44
top view
bottom view
VCC
RSSI
DATA out C51 L51 L50
L60 C61 C33 C30 C32 C31
R60
C60
C50 C43 R50
R51 L41
X10 R20 C20 C12 C10
C22 C21 L10 UAA3220TS C40 C11
R41 C44 C42 L40 R40
C70
C41 X40
RF in
MGM749
Dimensions in mm.
Fig.11 Printed-circuit board layout for fi(RF) = 433.92 MHz.
1999 Jan 22
25
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
UAA3220TS
handbook, full pagewidth
47
46
bottom view
jumper RSSI DATA out L60 C61 C33 C30 C32 C31 n.p. R50 C60 R60 C70 C50 C51 R51 L41 C11 C10 RF in L40 C40 R40 C41 C43 R41 X40 CON9
C20 X20 R20 C22 C21 C12
UAA3220TS
C42 C44
MHB459
Dimensions in mm.
Fig.12 Printed-circuit board layout for fi(RF) = 868.35 MHz.
1999 Jan 22
26
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
PACKAGE OUTLINE SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
UAA3220TS
SOT340-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 12 wM detail X A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.0 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 8.4 8.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.8 0.4 8 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT340-1 REFERENCES IEC JEDEC MO-150AG EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-09-08 95-02-04
1999 Jan 22
27
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
UAA3220TS
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Jan 22
28
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP PLCC(3), SO, SOJ not suitable suitable(2) suitable not recommended(3)(4) not recommended(5) suitable suitable suitable suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes
UAA3220TS
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1999 Jan 22
29
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
NOTES
UAA3220TS
1999 Jan 22
30
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude Shift Keying (ASK) receiver
NOTES
UAA3220TS
1999 Jan 22
31
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
SCA61
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545002/00/02/pp32
Date of release: 1999 Jan 22
Document order number:
9397 750 04896

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